Guangfu Machine

Wet Bench:

Furnace Systems

1.Oxidation & Diffusion Furnaces

2.Rapid Temperture Annealing (RTA)

Chemical Vapor Deposition Systems

1.Low Pressure Chemical Vapor Deposition (LPCVD)

2.Plasma-Enhanced Chemical Vapor Deposition (PECVD)

3.Atomic Layer Chemical Vapor Deposition System (ALD)

Lithography Systems

1.Laser Pattern Generator (DWL-200)

2.Pattern Generator

Exposure Machine:

1.Litho Accessories Machine

2.Double Side Mask Aligner (A)

3.Double Side Mask Aligner (B)

Dry Etch Systems:

1.Reactive Ion Etching Systems for Conductive Materials:

(1).Poly-Si Reactive Ion Etching System (Poly-Si RIE)

(2).High Density Plasma Reactive Ion Etching System, HDP-RIE

(3).Si Deep-RIE

(4).Shallow Si RIE

2.Reactive Ion Etching System for Dielectric Materials:

(1).Dielectric Materials Reactive Ion Etching System (RIE-400iP-1)

(2).Dielectric Materials Reactive Ion Etching System (RIE 200L)

(3).Dielectric Materials Reactive Ion Etching System (RIE-400iP-2)

Vacuum Deposition Systems

1.Thermal Evaporation System:

(1).Thermal Evaporation Coater

(2).Dual E-Gun Evaporation System (A)

(3).Dual E-Gun Evaporation System (B)

2.High Vacuum Coation System:

(1).Sputtering System (A)

(2).Sputtering System (B)

(3).High Vacuum Deposition System

3.(Department of Electronics) E-Beam Evaporator System

Analysis Systems

1.Dual beam [focused ion beam & electron beam] System (FIB)

2.Cold Field Emission Scanning Electron Microscope & Energy Dispersive Spectrometer (SEM SU-8010)

3.High-Resolution Cold Field Emission Scanning Electron Microscope & Energy Dispersive Spectrometer, SEM, EDS (SEM S-4700I)

4.Reflectometer

6.4-point Probe

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